Copper Disc,CAS RN: 7440-50-8
Product Code : ECu-A184-CU-CU
HANG JI specializes in producing high purity Copper Disc,CAS*: 7440-50-8 with the smallest possible average grain sizes,Purities may include 99%, 99.9%, 99.99%, 99.999% and 99.9999%, which are sometimes referred to as 2N, 3N, 4N, 5N and 6N,6N5, and in some cases up to 99.99999% (7N),99.999999% (8N),HANG JI produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Our standard powder particle sizes average in the range of - 325 mesh, - 200 mesh,- 100 mesh, 10-50 microns and submicron ( 1 micron). We can also provide in the nanoscale range.Powders are also useful in any application where high surface areas are desired such as water treatment and in fuel cell and solar applications. Nanoparticles also produce very high surface areas .Quality inspection department staff which uses atomic spectroscopy, x-ray diffraction analysis, scanning electron microscopy, glow discharge mass spectroscopy (GDMS), and BET surface area analysis, among other technologies, to ensure that the elemental composition and structural properties of each product rigorously adhere to our standards.Additional technical, research and safety (MSDS) information is available,
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CAS #: 7440-50-8
Linear Formula: Cu
MDL Number: MFCD00010965
EC No.: 231-159-6
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Synonyms: :----------------
Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper
Molecular Weight: 63.55
Appearance: Reddish Metal
Melting Point: 1085 °C
Boiling Point: 2562 °C
Density: 8.96 g/cm3
Solubility in H2O: N/A
Poisson's Ratio: 0.34
Young's Modulus: 110–128 GPa
Vickers Hardness: 369 MPa
Thermal Conductivity: 401 W ·m-1 ·K-1
Thermal Expansion: (25 °C) 16.5 µm·m-1·K-1
Electrical Resistivity: 1.673 μΩ-cm @ 20 °C
Electronegativity: 1.90 Paulings
Specific Heat: 0.39 kJ/kg K
Heat of Fusion: 13.26 kJ ·mol-1
Heat of Vaporization: 300.4 kJ ·mol-1
Health & Safety Information
Signal Word: Danger
Hazard Statements: H228-H400
Hazard Codes: F
Risk Codes: 11
Safety Statements: 16
RTECS Number: GL5325000
Transport Information: UN 3089 4.1/PG 2
WGK Germany: 3
Chemical Identifiers
Linear Formula: Cu
Pubchem CID: 23978
MDL Number: MFCD00010965
EC No.: 231-159-6
Beilstein/Reaxys No.: N/A
SMILES: [Cu]
InchI Identifier: InChI=1S/Cu
InchI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N
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Packing of
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 3464 gallon liquid totes Special package is available on request.
